Search results for "Laser writing"
showing 5 items of 5 documents
Copper patterning on dielectrics by laser writing in liquid solution
1994
A technique suitable for laser induced deposition of copper on LiNbO 3 and glass is presented. Deposition is achieved from Cu salt solution mixed with glycerol, after coating the surface with a very thin metal film. High resolution and low electrical resistivity can be achieved, using laser power levels in the 20-mW range. The technique can be used for electrode and interconnect fabrication in integrated optical devices, as well as mask repair or microelectronics applications.
Laser Beam Lithography For 3-D Surface Patterning
1993
A low power laser processing unit, for microlithographic applications on non-planar surfaces, is described. By combining proper laser beam handling, micropositioning, software control and surface coating techniques, a 5-axis robotic system for laser writing has been set up. Light from a He-Cd laser source is fiber-delivered to a writing head, which moves around a resist coated solid object. After exposure, traditional wet processing can be applied. The unit is capable of patterning metal films deposited on samples up to a size of 50x50x100 mm, with 5 micrometer spatial resolution. An application in 3-D circuit fabrication is presented.
Flexible Laser Tracing Systems for Defining Thin Film Hybrid Geometries
1994
A recent programme of technical collaboration between Alelco, DIE of Palermo and CRES of Monreale has led to the development and operative confirmation of a technique for delineating conductive microgeometries on various types of Substrates. This technique, using a flexible System of laser microlithography on planar (2-D) or three-dimensional (3-D) surfaces, has led to the development of several types of thin film components for use at both low and high frequencies. © 1994, MCB UP Limited
Nanofabrication on 2D and 3D Topography via Positive‐Tone Direct‐Write Laser Lithography
2019
Direct laser writing (DLW) lithography using two‐photon absorption is a powerful technique mostly used for fabrication of complex structures in micro‐ and nanoscale, by photopolymerizing a negative‐tone resist. In contrast, in this study it is demonstrated that DLW is also well suited for fabricating nano‐ to microscale metallic structures using lift‐off and a positive‐tone photoresist. It is shown first that versatile, fast and large area fabrication is possible on flat two‐dimensional insulating substrates, and an expression for how the line width varies with the scanning speed is derived, with excellent agreement with the experiments. Even more interestingly, a unique application for the…
Resist Coating of Cylindrical Samples for 3‐D Lithography
1995
A quantitative investigation of a dipping technique for depositing a thin layer of resist on circularly symmetrical objects is presented. The results obtained are valuable for preparing three-dimensional (3-D) surfaces suited for spatial microlithographic processes in the 1 to 10 μm linewidth range. © 1995, MCB UP Limited